摘要： 针对多芯粒异构复杂结构采用传统的功能测试方案无法准确定位内部互连故障，提出一种基于边界扫描的多芯粒互连线测试方法，实现对芯粒芯片互连故障的检测。基于IEEE 1149.1边界扫描协议与互连线测试优化算法，通过ATE测试系统识别内部互连故障线路，从而准确检测出芯片故障缺陷。与传统测试方法相比，基于边界扫描的多芯粒互连线测试方法稳定可靠，能够精确定位芯片内部互连故障，大幅提高测试效率，保证芯粒系统的可靠性应用。

中图分类号：TN407 文献标志码：A DOI: 10.16157/j.issn.0258-7998.257100
中文引用格式： 陈龙，黄健，解维坤，等. 基于边界扫描的多芯粒异构集成系统互连线测试方法[J]. 电子技术应用，2026，52(3)：46-50.
英文引用格式： Chen Long，Huang Jian，Xie Weikun，et al. Interconnect testing method for multi-chiplet heterogeneous integrated systems based on boundary scan[J]. Application of Electronic Technique，2026，52(3)：46-50.

Interconnect testing method for multi-chiplet heterogeneous integrated systems based on boundary scan

Abstract： For multi-chiplet heterogeneous complex structures, traditional functional testing methods are unable to accurately locate internal interconnection faults. A boundary-scan-based interconnect testing method for multi-chiplet is proposed, which enables the detection of interconnect faults between chiplets. Based on the IEEE 1149.1 boundary-scan protocol and an optimized interconnect testing algorithm, this method uses an Automatic Test Equipment (ATE) testing system to identify faulty internal interconnection lines, thereby accurately detecting chip faults and defects. Compared with traditional testing methods, the boundary-scan-based interconnect testing method for multi-chiplet is stable and reliable. It can accurately pinpoint internal interconnection faults within the chip, significantly improves testing efficiency, and ensures the reliable application of chiplet systems.

Key words : chiplet；boundary scan；interconnect test；fault defect