摘要： 总结了多通道大功率T/R组件散热设计中面临的问题和挑战，分析了各种散热方案的散热能力。微通道和歧管微通道散热技术在高热流密度散热场景得到广泛关注，成为大功率、高热流密度集成电路一种有效散热手段，同时多通道的流量分配是影响温度均匀性的重要因素。应用上述技术，提出一种应用于多通道T/R组件模块散热方案的设计方法并应用在具体散热方案设计中，采用计算流体动力学方法对各种方案分析比较和评价，嵌入载台的歧管微通道及并联分流方案，可有效解决局部功率密度大于500 W/cm2的多通道T/R组件冷却问题，热阻和通道间温度均匀度小于2℃。

中图分类号：TN958.7 文献标志码：A DOI: 10.16157/j.issn.0258-7998.256766
中文引用格式： 张文超，孙嘉庆. 多通道大功率氮化镓T/R组件模块散热技术研究[J]. 电子技术应用，2025，51(9)：84-89.
英文引用格式： Zhang Wenchao，Sun Jiaqing. Research on heat dissipation technology for multi-channel high power GaN T/R module[J]. Application of Electronic Technique，2025，51(9)：84-89.

Research on heat dissipation technology for multi-channel high power GaN T/R module

Abstract： This paper summarizes the problems and challenges faced in the heat dissipation design of multi-channel high-power T/R module, and analyzes the heat dissipation capabilities of various heat dissipation solutions. Microchannel and manifold microchannel heat dissipation technology has received widespread attention in high heat flux density heat dissipation scenarios, and has become an effective heat dissipation method for high-power, high heat flux density integrated circuits. At the same time, multi-channel flow distribution is an important factor affecting temperature uniformity. Applying the above technology, this paper proposes a design method for heat dissipation solutions for multi-channel T/R component modules and applies it to the design of specific heat dissipation solutions. The Computational Fluid Dynamics(CFD) method is used to analyze, compare and evaluate various solutions. The manifold microchannel and parallel shunt solution embedded in the carrier can effectively solve the cooling problem of multi-channel T/R components with local power density greater than 500 W/cm2, and the thermal resistance and temperature uniformity between channels are less than 2 degrees Celsius.

Key words : GaN；multi-channel；T/R module；microchannel；manifold microchannel；flow distribution